Pure Magnetron Sputtering Equipment
High-uniformity sputtering for optical and functional films
System Overview
The HN-MS-002 industrial magnetron sputtering system is designed for thin-film uniformity and composition control in optical coatings, functional films, and precision device fabrication. Planar and cylindrical magnetron configurations are available to suit target geometry and process requirements.
Working Principle
Magnetron sputtering confines a plasma near the target surface using crossed electric and magnetic fields, enabling high-rate sputtering of a wide range of metallic, ceramic, and compound target materials. DC, RF, or pulsed DC power may be applied depending on target conductivity. Reactive sputtering in nitrogen or oxygen atmospheres allows deposition of nitride, oxide, and oxynitride films.
Core Advantages
- Excellent film uniformity across large substrates
- DC, RF, and pulsed-DC power supply options
- Reactive sputtering capability for nitrides and oxides
- Low substrate thermal load during deposition
- Wide target material compatibility: metals, alloys, ceramics
- Configurable multi-target carousel for multilayer deposition
- Process recipe storage and automated sequence execution
Technical Specifications
| Chamber | Electropolished stainless-steel high-vacuum chamber |
|---|---|
| Targets | 3–6 planar magnetron targets in 3, 4, or 8-inch formats |
| Power Supply | Pulsed DC sputtering and RF power supplies |
| Vacuum System | Turbomolecular high-vacuum system; ultimate pressure up to 5 × 10⁻⁴ Pa |
| Workpiece Fixture | High-capacity planetary fixture with adjustable substrate bias |
| Process Gas | Multi-channel precision MFC gas control |
| Control | Automatic process recipe storage |
Specifications are representative. Final system parameters are defined during configuration. Contact our engineering team for detailed documentation.
