Lab Multi-arc & Magnetron Sputtering Composite Coating Platform
Research-scale composite platform for multilayer coating studies
System Overview
The HN-MA-MS-R-008 brings the composite arc-and-sputtering architecture of the industrial HN-MA-MS-003 to the research laboratory. Designed for universities, coating research centers, and advanced industrial R&D departments, this platform supports systematic investigation of multilayer coating architectures, graded composition films, and novel hard coating compositions.
Working Principle
Arc and sputtering sources are independently controlled but share a common vacuum environment, enabling single-vacuum sequential or simultaneous deposition of layers from each source type. This allows researchers to precisely map the effect of each layer composition, thickness, and interface condition on film performance.
Core Advantages
- Combined arc and sputtering in a compact research chamber
- Enables systematic multilayer and graded coating research
- Independent power, bias, and gas control for each source type
- Scalable process parameters for industrial transfer
- Supports DLC, nanocomposite, and hard multilayer studies
- Accessible chamber design with multiple diagnostic ports
- Comprehensive data logging for research reproducibility
- Wide-range substrate heating from ambient to 1200 °C with in-situ annealing
- Integrated in-situ ion cleaning and compatibility with wafers up to 8 inches
Technical Specifications
| Chamber | φ500 mm partitioned composite chamber |
|---|---|
| Standard Sources | 2 arc cathodes and 2 magnetron sputtering targets |
| Power Supply | Arc, DC/RF sputtering, and adjustable composite bias supplies |
| Sample Fixture | Multi-position fixture for parallel comparison samples |
| Process Gas | Multi-channel precision gas-mixing system |
| Control | Open process programming with automatic experiment-data storage and export |
| Temperature Control | Wide-range substrate temperature control from ambient to 1200 °C with in-situ annealing |
| Substrate Preparation | Integrated in-situ ion cleaning for substrate surface activation before deposition |
| Sample Compatibility | Wafers up to 8 inches and small research samples or coupons |
Specifications are representative. Final system parameters are defined during configuration. Contact our engineering team for detailed documentation.
