Multi-arc & Magnetron Sputtering Composite Coating Equipment
Combine arc and sputtering in one integrated production platform
System Overview
The HN-MA-MS-003 integrates multi-arc ion plating and magnetron sputtering sources within a single vacuum chamber, enabling sequential or simultaneous multi-process depositions. This composite architecture supports the creation of complex multilayer coating stacks — such as adhesion interlayers deposited by arc followed by functional overcoats applied by sputtering — without breaking vacuum.
Working Principle
By combining the high ionization and deposition rate of multi-arc with the compositional precision and low macro-particle generation of magnetron sputtering, the HN-MA-MS-003 enables engineered coating architectures impossible with single-process systems. Arc sources handle adhesion layers and high-hardness nitrides; sputtering targets deposit smooth, stoichiometrically controlled functional layers.
Core Advantages
- Single-chamber multi-process architecture eliminates inter-process contamination
- Sequential or simultaneous operation of arc and sputtering sources
- Enables graded interlayers, multilayer stacks, and nanocomposite films
- Wider composition space than any single-process system
- Common vacuum, heating, and bias infrastructure reduces footprint
- Flexible target-to-substrate geometry for uniform coverage
- Full PLC recipe management with per-process parameter control
Technical Specifications
| Chamber | Partitioned composite vacuum chamber |
|---|---|
| Standard Sources | 4 arc cathodes and 3 magnetron sputtering targets |
| Power Supply | Arc, DC/RF sputtering, and adjustable composite bias supplies |
| Vacuum System | Two-stage independent pumping system |
| Process Gas | Multi-channel precision MFC reactive-gas control |
| Workpiece Fixture | High-capacity planetary rotation fixture |
| Control | Segmented automatic process programs |
Specifications are representative. Final system parameters are defined during configuration. Contact our engineering team for detailed documentation.
